StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024, during the IMAPS Annual Symposium, recognizing StratEdge’s significant contributions to advancing the microelectronics industry and its longstanding support of the IMAPS organization.
The IMAPS Corporate Recognition Award honors a corporation that has demonstrated exceptional technical contributions to the microelectronics industry while also showing strong support for IMAPS through organizational memberships, sponsorships, and active participation in IMAPS-sponsored activities. StratEdge has consistently upheld these values, furthering technological advancements and fostering community within the microelectronics field.
“We want to thank Beth Keser, IMAPS Society Awards Chair; Brian Schieman, IMAPS Executive Director; Erica Faulk, IMAPS President; and the IMAPS Executive Council and Staff for this award,” said Casey Krawiec, Vice President of Global Sales at StratEdge Corporation. “IMAPS is an organization full of wonderful people that for many years has provided opportunities for collaboration within the microelectronic packaging community. We are so pleased that StratEdge has been chosen as this year’s recipient.”
This award is a significant milestone for StratEdge, underscoring the company’s role as an innovator and key supporter of the microelectronics community. StratEdge remains dedicated to leading the development of high-performance packaging solutions that push the boundaries of what is possible in semiconductor technology.
Photo available at: www.stratedge.com/imaps-corporate-award.png
About StratEdge Corporation
StratEdge Corporation designs, manufactures, and provides assembly services for a complete line of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic and lower-cost molded ceramic packages, specializing in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecom for 5G, VSAT, broadband wireless, satellite, defense, test and measurement, automotive, clean energy, and down-hole. All packages are lead-free and most meet RoHS and WEEE standards. Our facility in Santee, California, near San Diego, is both ITAR registered and ISO 9001:2015 certified.
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