Technavio has been monitoring the global food packaging robotics market size and it is poised to grow by USD 813.02 million during 2020-2024, progressing at a CAGR of 5% during the forecast period. The report offers an up-to-date analysis regarding the current market scenario, latest trends and drivers, and the overall market environment.
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Technavio has announced its latest market research report titled Global Food Packaging Robotics Market 2020-2024 (Graphic: Business Wire)
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The market is concentrated, and the degree of concentration will accelerate during the forecast period. ABB Ltd., DENSO Corp., FANUC Corp., KUKA AG, Midea Group Co. Ltd., Mitsubishi Electric Corp., OMRON Corp., Robert Bosch GmbH, Teradyne Inc., and Yaskawa Electric Corp. are some of the major market participants. To make the most of the opportunities, market vendors should focus more on the growth prospects in the fast-growing segments, while maintaining their positions in the slow-growing segments.
The integration of advanced technologies has been instrumental in driving the growth of the market. However, the high cost of deploying robotics might hamper market growth.
Food Packaging Robotics Market 2020-2024 : Segmentation
Food Packaging Robotics Market is segmented as below:
-
Application
- Primary Packaging
- Secondary Packaging
-
Geography
- APAC
- Europe
- North America
- MEA
- South America
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Food Packaging Robotics Market 2020-2024 : Scope
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources. Our food packaging robotics market report covers the following areas:
- Food Packaging Robotics Market size
- Food Packaging Robotics Market trends
- Food Packaging Robotics Market industry analysis
This study identifies the emergence of collaborative robots as one of the prime reasons driving the food packaging robotics market growth during the next few years.
Food Packaging Robotics Market 2020-2024 : Vendor Analysis
We provide a detailed analysis of around 25 vendors operating in the food packaging robotics market, including some of the vendors such as ABB Ltd., DENSO Corp., FANUC Corp., KUKA AG, Midea Group Co. Ltd., Mitsubishi Electric Corp., OMRON Corp., Robert Bosch GmbH, Teradyne Inc., and Yaskawa Electric Corp. Backed with competitive intelligence and benchmarking, our research reports on the food packaging robotics market are designed to provide entry support, customer profile and M&As as well as go-to-market strategy support.
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Food Packaging Robotics Market 2020-2024 : Key Highlights
- CAGR of the market during the forecast period 2020-2024
- Detailed information on factors that will assist food packaging robotics market growth during the next five years
- Estimation of the food packaging robotics market size and its contribution to the parent market
- Predictions on upcoming trends and changes in consumer behavior
- The growth of the food packaging robotics market
- Analysis of the market’s competitive landscape and detailed information on vendors
- Comprehensive details of factors that will challenge the growth of food packaging robotics market vendors
Table Of Contents :
Executive Summary
Market Landscape
- Market ecosystem
- Value chain analysis
Market Sizing
- Market definition
- Market segment analysis
- Market size 2019
- Market outlook: Forecast for 2019 – 2024
Five Forces Analysis
- Five forces summary
- Bargaining power of buyers
- Bargaining power of suppliers
- Threat of new entrants
- Threat of substitutes
- Threat of rivalry
- Market condition
Market Segmentation by Application
- Market segments
- Comparison by Application
- Primary packaging – Market size and forecast 2019-2024
- Secondary packaging – Market size and forecast 2019-2024
- Market opportunity by Application
Customer landscape
Geographic Landscape
- Geographic segmentation
- Geographic comparison
- APAC – Market size and forecast 2019-2024
- Europe – Market size and forecast 2019-2024
- North America – Market size and forecast 2019-2024
- MEA – Market size and forecast 2019-2024
- South America – Market size and forecast 2019-2024
- Key leading countries
- Market opportunity by geography
Market Drivers – Demand led growth
Market Challenges
Market Trends
Vendor Landscape
- Vendor landscape
- Landscape disruption
Vendor Analysis
- Vendors covered
- Market positioning of vendors
- ABB Ltd.
- DENSO Corp.
- FANUC Corp.
- KUKA AG
- Midea Group Co. Ltd.
- Mitsubishi Electric Corp.
- OMRON Corp.
- Robert Bosch GmbH
- Teradyne Inc.
- Yaskawa Electric Corp.
Appendix
- Scope of the report
- Currency conversion rates for US$
- Research methodology
- List of abbreviations
About Us
Technavio is a leading global technology research and advisory company. Their research and analysis focus on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.
View source version on businesswire.com: https://www.businesswire.com/news/home/20200721005712/en/