Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced TSMC
certified Cadence’s design solutions for the new TSMC
System-on-Integrated-Chips (TSMC-SoIC™) 3D advanced chip
stacking technology, which integrates heterogeneous chips—including
logic ICs and memory—that are fabricated on different process nodes onto
a single chip stack for a subsequent packaging process. A full suite of
Cadence® digital and signoff, custom/analog, and IC package
and PCB analysis tools have been optimized for TSMC’s SoIC chip stacking
technology, enabling mutual customers that require heterogeneous chipset
integration capabilities to create complex designs more efficiently.
For more information on the Cadence solutions that support the TSMC-SoIC
advanced packaging technology, visit www.cadence.com/go/soic.
SoIC, TSMC’s innovative multi-chip stacking techniques, expands upon
TSMC’s 3D Wafer-on-Wafer (WoW) and Chip-on-Wafer (CoW) technologies and
address the diverse design requirements for emerging applications,
including 5G, AI, IoT and automotive applications. TSMC and Cadence
collaborated to enhance tools, methodologies and flows, supporting
mutual customers to manage the overall connectivity and verification of
their chip integration solutions as part of the overall design. The
entire design cycle is enabled with multiple 3D featured tools working
together.
The Cadence tools in the flow include the Innovus™ Implementation
System, Quantus™ Extraction Solution, Voltus™ IC
Power Integrity Solution, Tempus™ Timing Signoff Solution,
Physical Verification System (PVS), Virtuoso® custom IC
design platform, SiP Layout, OrbitIO™ interconnect
designer, Sigrity™ PowerSI® 3D EM
Extraction Option, Sigrity PowerDC™ technology,
Sigrity XcitePI™ Extraction, Sigrity XtractIM™
technology and Sigrity SystemSI™ technology.
“Cadence and TSMC have a rich history of collaboration, which continues
as we today deliver innovative capabilities to support the new advanced
TSMC-SoIC chip stacking technology,” said Tom Beckley, senior vice
president and general manager, Custom IC & PCB Group at Cadence. “The
SoIC solution empowers our mutual customers to employ the latest 3D
techniques using our optimized tools, flows and methodologies to meet
tight design delivery deadlines.”
“The Cadence tools, reference flows and methodologies for our new SoIC
advanced chip stacking technology complement our well-established InFO,
WoW and CoWoS® chip integration solutions, providing
customers with even more flexibility to integrate multiple die onto a
single device using 3D stacking techniques,” said Suk Lee, TSMC senior
director, Design Infrastructure Management Division. “Our ongoing
collaboration with Cadence on advanced packaging technologies has
resulted in helping our mutual customers to achieve efficient and
successful product designs targeting 5G, AI, IoT and automotive
applications.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create
the innovative end products that are transforming the way people live,
work and play. Cadence software, hardware and semiconductor IP are used
by customers to deliver products to market faster. The company’s System
Design Enablement strategy helps customers develop differentiated
products—from chips to boards to systems—in mobile, consumer, cloud
datacenter, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine’s 100 Best
Companies to Work For. Learn more at cadence.com.
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are trademarks or registered trademarks of Cadence Design Systems, Inc.
All other trademarks are the property of their respective owners.
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